Findings of Questionnaire Distributed at First Forum

Following the conclusion of the first forum, attendees were asked to fill out a questionnaire. A summary of their opinions is provided below in the hope that it will provide an understanding of members' reactions to the forum and their expectations of the Echonet Consortium.

The Echonet Consortium hopes to proceed in a way that reflects members' opinions and meets their expectations.

1. Opinions on First Forum

  • Distribution of reference materials and list of names was good. Explanations were easy to understand and offered a future schedule, which helps our planning efforts.

  • Detailed content; may have been too technical for non-specialists to understand.

  • Was able to understand standardization plans. Looking forward to the early realization of an easy-to-use, low-cost network system.

  • Was able to grasp the overall Echonet architecture concept. Looking forward to more specific discussion (in future forums) of physical layer technology, communications interfaces, etc.

  • Would be easier to understand if specific examples of applications tapping the strengths of Echonet were presented.

2. Opinions on Future Forum Activities

  • Make it easier for attendees to ask basic questions. Would also like more time for questions and answers.

  • Would like to receive reference and explanatory materials that are not written for experts.

  • Would like to hear about lower-layer design, such as the physical layer (e.g., electric wire), in greater detail.

  • Would like to hear an explanation of communications middleware that provides specific examples along with expected scale and method of implementation. Would also like to receive more detailed reference materials for later reading that provide sufficient detail to begin designing products.

  • Would like to hear an explanation of the plug-and-play features and examples of the objects scheduled for standardization.

3. Other Expectations and Opinions

  • It was clear that there are many forum members and that they have high expectations of this project.

  • Would like the Web site to be expanded to provide more information for members.

  • Ultimately, the most important issue is interconnectivity. Would therefore like to see a "Connectivity Testing Forum" enabling members to bring in products for testing.